JIS K8152-1991 氯化镍

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【英文标准名称】:
【原文标准名称】:氯化镍
【标准号】:JISK8152-1991
【标准状态】:作废
【国别】:日本
【发布日期】:1991-02-01
【实施或试行日期】:1991-02-01
【发布单位】:日本工业标准调查会(JISC)
【起草单位】:
【标准类型】:()
【标准水平】:()
【中文主题词】:氯化钠;氯化物;钠无机化合物;镍无机化合物;铅无机化合物;盐;化学试剂
【英文主题词】:
【摘要】:
【中国标准分类号】:G62
【国际标准分类号】:
【页数】:
【正文语种】:


【英文标准名称】:Chemicalanalysisofrefractorymaterialglassandglazes.DeterminationofFe2+andFe3+bythespectralphotometricmethodwith1,10-phenanthroline
【原文标准名称】:耐火材料玻璃和釉的化学分析.用带有1,10.菲罗啉的分光光度法测定Fe和Fe
【标准号】:BSENISO14719-2012
【标准状态】:现行
【国别】:英国
【发布日期】:2012-01-31
【实施或试行日期】:2012-01-31
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:
【英文主题词】:Analysis;Ceramics;Chemicalanalysisandtesting;Clay;Content;Determinationofcontent;Electrometry;Feldspars;Glass;Glazes;Iron;Ironcontent;Kaolin;Limestone;Materials;Materialstesting;Mathematicalcalculations;Measurement;Methodsofanalysis;Oxidicmaterials;Photometry;Photometry(chemicalanalysis);Quantitativeanalysis;Quartz;Rawmaterials;Refractorymaterials;Spectrophotometry;Testing
【摘要】:
【中国标准分类号】:Q40
【国际标准分类号】:81_040_10;81_060_10;81_080
【页数】:22P;A4
【正文语种】:英语


【英文标准名称】:TestMethodforEstimatingElectromigrationMedianTime-To-FailureandSigmaofIntegratedCircuitMetallizations
【原文标准名称】:评定电迁移平均失效时间和集成电路金属喷镀σ值的测试方法
【标准号】:ASTMF1260-1989
【标准状态】:作废
【国别】:
【发布日期】:1989
【实施或试行日期】:
【发布单位】:美国材料与试验协会(US-ASTM)
【起草单位】:F30.01
【标准类型】:(TestMethod)
【标准水平】:()
【中文主题词】:试验;应力;失效率;微电子学;喷镀金属
【英文主题词】:Acceleratedaging/testing-semiconductors;Ambientstresstemperature;Current-densitystress;Defects-semiconductors;Electricalconductors-semiconductors;Electromigration;Failureendpoint-electroniccomponents/devices;Integratedcircuits;Met
【摘要】:1.1Thistestmethodisdesignedtocharacterizethefailuredistributionofinterconnectmetallizationssuchasareusedinmicroelectroniccircuitsanddevicesthatfailduetoelectromigrationunderspecifiedd-ccurrent-densityandtemperaturestress.Thistestmethodisintendedtobeusedonlywhenthefailuredistributioncanbedescribedbyalog-Normaldistribution.1.2Thistestmethodisintendedforuseasarefereemethodbetweenlaboratoriesandforcomparingmetallizationalloysandmetallizationspreparedindifferentways.Itisnotintendedforqualifyingvendorsorfordeterminingtheuse-lifeofametallization.1.3Thetestmethodisanacceleratedstresstestoffour-terminalstructures(seeGuideF1259)wherethefailurecriterioniseitheranopencircuitinthetestlineoraprescribedpercentincreaseintheresistanceoftheteststructure.1.4Thistestmethodallowstheteststructuresofatestchiptobestressedwhilestillpartofthewafer(oraportionthereof)orwhilebondedtoapackageandelectricallyaccessibleviapackageterminals.1.5Thistestmethodisnotdesignedtocharacterizethemetallizationforfailuremodesinvolvingshortcircuitsbetweenadjacentmetallizationlinesorbetweentwolevelsofmetallization.1.6Thistestmethodisnotintendedforthecasewherethestresstestisterminatedbeforeallpartshavefailed.1.7Thisstandardmayinvolvehazardousmaterials,operations,andequipment.Thisstandarddoesnotpurporttoaddressallofthesafetyproblemsassociatedwithitsuse.Itistheresponsibilityoftheuserofthisstandardtoestablishappropriatesafetyandhealthpracticesanddeterminetheapplicabilityofregulatorylimitationspriortouse.
【中国标准分类号】:L55
【国际标准分类号】:31_200
【页数】:7P.;A4
【正文语种】: